岗位职责：
a. Degree in Electrical/Mechanical/Chemical Engineering/Material science；
Minimum 5 years working experience in SEMICON industry.b. Candidate must have a combined experience in package development and package process control and manufacturing.c. Ability to clearly and concisely analyze and present experimental data.d. Strong Motivation and drive for project closure, “Can Do Attitude”.e. Failure Mode Effect Analysis (FMEA).f. Statistical Process Control (SPC).g. Design of Experiment (DOE) & 8 Discipline Reporting.h. Good management skill to lead and motivate engineering teami. Willing to work Overtime.
任职条件：
a. Improve packaging techniques or introduce new packaging techniques for new or improved products. b. Identify new concepts, develop solutions and support implementation of new packages. c. Identify and evaluate new packaging materials, technologies and concepts as well as emerging packaging trends. d. Support customers’ package and process development activities. f. Interact with vendors and customers to develop product specifications.g. Management yield enhancement activites through process and material improvement. h. Troubleshooting， Repairing of Production Equipment Management. i. Statistical Process Control(SPC), Design Of Experiment(DOE), Customer Interface will be advantageous .